U.S. official praises South Korea chip expertise at AI summit

A senior U.S. official praised South Korea's semiconductor capabilities at the Pax Silica Summit in Washington on June 25. Under Secretary Jacob Helberg expressed expectations for Seoul's contributions to AI supply chain security.

Under Secretary of State for Economic Affairs Jacob Helberg said on Thursday that "South Korea is obviously home to some of the world's largest memory chips" and "punches far above its weight in terms of chip production, technical expertise, and engineering."

Second Vice Foreign Minister Kim Jina represented South Korea at the gathering of nearly 20 countries. Helberg noted regular bilateral talks and excitement to deepen collaboration on AI infrastructure security.

The United States announced a US$50 million commitment to the Pax Pass Project along with the Declaration on AI Opportunity and Foundry School Initiative. Helberg stressed that "these are opportunities that trusted partners can tackle together."

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Nvidia CEO Jensen Huang shaking hands with Samsung and SK hynix executives in a Seoul conference room to mark AI partnerships
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Nvidia CEO Huang concludes South Korea visit with AI partnerships

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Nvidia CEO Jensen Huang wrapped up his South Korea visit on June 9, emphasizing broader AI ecosystem cooperation. The trip produced multiyear partnerships with SK hynix and Samsung Electronics, plus discussions on physical AI.

President Lee Jae Myung met Samsung Electronics Chairman Lee Jae-yong on Thursday at Cheong Wa Dae to discuss regional semiconductor investments, including a possible chip cluster in the southwestern Honam region.

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Nvidia CEO Jensen Huang met SK Group Chairman Chey Tae-won in Taipei to discuss cooperation in AI memory chips.

Defense Minister Ahn Gyu-back stressed South Korea's efforts to bolster self-reliant defense capabilities alongside a stronger alliance with the United States during a speech in Singapore on May 30.

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SK Hynix Inc. increased its workforce by more than 2,000 last year due to rising demand for memory chips.

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