Инновации

IBM has developed a prototype computer chip that packs nearly 100 billion transistors into a fingernail-sized device. The 10 by 15 millimetre chip uses a new three-dimensional layering technique to achieve record density.

16 июня 2026 Сообщено ИИ

Xia Baolong, director of the Hong Kong and Macau Affairs Office, has recognised local efforts on innovation projects and urged the city to seize national opportunities.

Dyson has released the Find+Follow Purifier Cool, a bladeless fan and air purifier that uses artificial intelligence to track movement and direct airflow automatically.

25 мая 2026 Сообщено ИИ

Thai Ambassador Tanee Sangrat outlined plans to expand bilateral ties beyond tourism and culture into investment, industrial cooperation and innovation during a May 19 interview in Seoul.

Hong Kong's innovation and technology secretary Sun Dong has reported strong enthusiasm from leading Swedish universities for deeper collaboration during his recent visit to the country.

10 мая 2026 Сообщено ИИ

Funeral services company La Ascensión announced that Neiva will pioneer alkaline hydrolysis in Latin America as an alternative for the final disposition of the deceased. The new service center is projected to open in the first quarter of 2027.