Chinese semiconductor engineer leaves US seeking research freedom

Chinese semiconductor engineer Xu Zhenpeng says he left the United States for China to pursue a more independent research environment and long-term academic goals. China's rapidly evolving advanced manufacturing research ecosystem was a key driver.

Xu Zhenpeng, a Chinese semiconductor engineer, has returned to China from the United States. Before his departure, he led a team at Atomic Semi in California developing a new kind of chipmaking machine using 3D-printed parts that would be smaller, faster, and cheaper than today's large, costly production equipment.

Xu said his decision was motivated by long-term academic goals and a desire for a more independent research environment. "Meanwhile, China's advanced manufacturing research ecosystem is evolving rapidly," he added. While Xu did not specify which corporate compliance rules he was referring to, such policies are typically designed to ensure companies follow government restrictions.

His move highlights a trend of more Chinese scientists leaving the US to return to China. Xu's return underscores the competition between China and the US in the semiconductor sector, and China's push for technological self-reliance. He is associated with Shanghai Jiao Tong University (SJTU), though details are unclear.

Makala yanayohusiana

US official and Taiwanese executive shaking hands over semiconductor tariff deal document, with flags, chips, and tariff graphs in background.
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US official says Trump administration will seek separate semiconductor tariff deals

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The Trump administration will pursue separate semiconductor tariff agreements with individual countries, a US official said, following a deal with Taiwan this week. The agreement allows Taiwanese firms building US chip capacity to import materials tariff-free up to 2.5 times planned output during construction. South Korea's trade minister assessed the impact on local chipmakers as limited.

Rising talent in micron-precision 3D printing, Xu Zhenpeng, announced on social media his move from a California startup to an academic position in Shanghai, China. Previously, he led a team developing 3D printing techniques to make chip production faster and cheaper than conventional multimillion-dollar machines.

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As the US pushes for manufacturing repatriation, Taiwan Semiconductor Manufacturing Company (TSMC) is grappling with unexpected challenges in building a massive chip factory in the desert north of Phoenix, Arizona. Unlike Taiwan's single-permit process, the US's complex regulatory maze requires the firm to create around 18,000 rules from scratch, costing US$35 million. TSMC chairman C.C. Wei says this is no longer just a business investment but an expensive social experiment in transplanting industrial culture.

Chinese semiconductor industry experts and executives express confidence in handling potential Japanese restrictions on photoresist exports to China, highlighting domestic alternatives and supply chain diversification. No production disruptions have been reported so far.

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China is leveraging high-tech manufacturing, including 3D printers, to gain a competitive edge in global markets. In 2025, exports of high-tech products rose 13.2 percent, contributing to overall export growth. Shenzhen firms like Anycubic and Elegoo are expanding overseas through innovation and cost advantages, reaching over 150 countries and regions.

Consciousness expert Steven Laureys has joined Hangzhou Normal University, praising China's opportunities in science amid challenging times in the US. He highlights China's efficient resource unification and collaborative push.

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Acclaimed computer scientist Ling Haibin, known for developing the world's first mobile plant identification app, has left the US to join Westlake University in China. He cited greater freedom for innovative research as a key reason for the move.

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