Toradex has introduced two new families of ultra-compact computer-on-module products powered by NXP's i.MX 93 and i.MX 91 processors. These modules target industrial automation and edge systems in space-constrained environments. The lineup offers scalable options for AI and headless applications.
Toradex announced the OSM and Lino computer-on-module families on December 6, 2025, integrating NXP's i.MX 93 and i.MX 91 processors. Designed for high-volume production in rugged settings, the modules measure just 30x30mm and include variants such as OSM iMX93, OSM iMX91, Lino iMX93, and Lino iMX91.
The i.MX 93 processors feature a neural processing unit delivering 0.5 TOPS for edge AI tasks like machine learning in vision and analytics. In contrast, the i.MX 91 provides a single Arm Cortex-A55 core at 1.4 GHz, suited for cost-sensitive, headless Linux uses in gateways and controllers.
Both form factors share the compact footprint but differ in integration. The OSM family follows the Open Standard Module Size-S specification with a solderable LGA design for vibration resistance and automated assembly. The Lino family uses dual 100-pin board-to-board connectors for simpler prototyping and maintenance, compatible with the Verdin ecosystem via an adapter.
Memory options reach up to 2GB of LPDDR4 RAM and 256GB of eMMC flash. Connectivity includes dual Gigabit Ethernet ports—with time-sensitive networking on i.MX 91—two CAN FD interfaces, and USB 2.0 ports. For multimedia, i.MX 93 modules support MIPI DSI, LVDS displays, MIPI CSI-2 camera input, and a 2D graphics accelerator, plus various low-speed I/O like UART, I2C, SPI, and ADC.
Software support centers on the Torizon Linux platform, a Yocto-based system with secure over-the-air updates and monitoring to meet standards like the EU Cyber Resilience Act. Long-term availability extends to 2038 for i.MX 93 and 2040 for i.MX 91 variants. Toradex plans to demonstrate the modules at Embedded World 2026 in Nuremberg, Germany, from March 10-12 at Hall 4, Booth 4-240.