李在明总统周四在青瓦台会见了三星电子会长李在镕，讨论地区半导体投资计划，其中包括在西南部湖南地区建立芯片产业集群的可能性。
双方会谈持续了一个多小时，就三星电子和SK海力士预计即将公布的大规模投资项目交换了意见。此次会谈是为下周一即将召开的政府区域均衡发展会议所做的筹备工作的一部分。
总统政策室室长金容范指出，首尔大都市区的土地、电力和水资源限制日益严峻，建议在首都圈以外增设一个半导体集群。目前，首尔以南的龙仁市已有一个在建的集群。
李在镕本周早些时候视察了三星的高带宽内存（HBM）设施，并强调要致力于在人工智能半导体市场保持领先地位。该公司在2月启动HBM4量产后的四个月内，其销售额已突破10亿美元。
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HANOI—Following his Wednesday summit with Vietnam's top leader To Lam, President Lee Jae-myung meets Prime Minister Le Minh Hung on Thursday to advance bilateral ties in supply chains, infrastructure and energy. Twelve MOUs were signed on energy, tech and culture, with a large business delegation in tow.
A senior U.S. official praised South Korea's semiconductor capabilities at the Pax Silica Summit in Washington on June 25. Under Secretary Jacob Helberg expressed expectations for Seoul's contributions to AI supply chain security.
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President Lee Jae Myung visited the headquarters of HD Hyundai Heavy Industries Co. in Ulsan on Wednesday. He pledged government support for the country's shipbuilding industry. The president also inspected liquefied natural gas carriers under construction for export.
President Lee Jae Myung is set to hold a bilateral summit on Wednesday with Vietnam's top leader To Lam in Hanoi. Discussions will focus on strengthening economic ties and supply chain coordination amid global uncertainties. Lee's state visit marks the first by a foreign leader since To Lam was elected state president earlier this month.
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President Lee Jae-myung returned home on April 24 after a six-day trip to India and Vietnam. He focused on expanding cooperation in energy and supply chains amid Middle East uncertainties during summits with the countries' leaders. Agreements aimed at doubling trade volumes and deepening strategic ties were reached.