华为
北京大学研究人员周二发布了一款电子设计自动化原型工具。该软件支持华为前一日推出的LogicFolding架构，旨在助力开发无需西方工具的先进制程半导体。
由 AI 报道
Huawei announced it aims to produce advanced chips matching 1.4-nanometer standards by 2031. The claim came during a semiconductor symposium held in Shanghai.
December 27, 2025 20:26