北京大学研究人员周二发布了一款电子设计自动化原型工具。该软件支持华为前一日推出的LogicFolding架构，旨在助力开发无需西方工具的先进制程半导体。
北京大学研究人员宣称在芯片设计软件领域取得突破。该电子设计自动化（EDA）原型工具由该校集成电路学院宣布。
这款新型EDA工具兼容华为的LogicFolding架构，而华为是在周一刚刚推出该架构的。
由于全球EDA市场长期被新思科技（Synopsys）和楷登电子（Cadence Design Systems）等公司垄断，开发国产替代方案已成为当务之急。华为的目标是在2031年前生产出性能与先进1.4纳米技术相当的芯片。
Huawei announced it aims to produce advanced chips matching 1.4-nanometer standards by 2031. The claim came during a semiconductor symposium held in Shanghai.
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A team from Nanjing University’s School of Integrated Circuits and Huawei has developed the first molybdenum disulfide-based multi-bit parallel microprocessor.
Intel CEO Lip-Bu Tan announced that the company will work closely with Elon Musk to support the Terafab project. The initiative involves a joint chip development and fabrication effort by SpaceX and Tesla. A photo shows the executives shaking hands last weekend.
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A US Congressional commission concludes that China’s open ecosystem has narrowed performance gaps with top Western large language models. The report highlights the compounding force of open-source models and manufacturing dominance.