Peking University unveils 3D design tool for Huawei chips

Researchers at Peking University unveiled a prototype electronic design automation tool on Tuesday. The software supports Huawei's LogicFolding architecture introduced the day before. It aims to help develop advanced semiconductors without Western tools.

Researchers at Peking University have claimed a breakthrough in microchip design software. The prototype tool for electronic design automation was announced by the university's School of Integrated Circuits.

The new EDA tool is compatible with Huawei's LogicFolding architecture. Huawei introduced that architecture on Monday.

Developing domestic alternatives has become a priority because the global EDA market is dominated by companies such as Synopsys and Cadence Design Systems. Huawei aims to produce chips by 2031 that match the performance of advanced 1.4-nanometre technology.

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Huawei announced it aims to produce advanced chips matching 1.4-nanometer standards by 2031. The claim came during a semiconductor symposium held in Shanghai.

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A team from Nanjing University’s School of Integrated Circuits and Huawei has developed the first molybdenum disulfide-based multi-bit parallel microprocessor.

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