南京大学集成电路学院与华为的一个团队共同开发了首款基于二硫化钼的多位并行微处理器。
该设备被命名为“孟奇-1000”（Mengqi-1000），由二维材料制成。这是全球首款此类二维半导体芯片。该研究成果于周二发表在《自然-电子学》期刊上。研究人员表示，该芯片突破了硅基材料的尺寸限制，从而提高了集成密度并降低了数据延迟。诸如二硫化钼等二维材料仅有原子厚度，这使得电子能够稳定且高效地移动，从而支持微芯片实现更高的集成密度。
华为团队研制出首款二维二硫化钼微处理器
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