Huawei announced it aims to produce advanced chips matching 1.4-nanometer standards by 2031. The claim came during a semiconductor symposium held in Shanghai.
The company stated that its next-generation chips will be feasible and affordable. He Tingbo, head of Huawei's chip department, made the remarks at the event, according to The Wall Street Journal. Huawei faces ongoing US trade sanctions that began in 2019 and limit access to specialized manufacturing equipment.