Huawei announced it aims to produce advanced chips matching 1.4-nanometer standards by 2031. The claim came during a semiconductor symposium held in Shanghai.
The company stated that its next-generation chips will be feasible and affordable. He Tingbo, head of Huawei's chip department, made the remarks at the event, according to The Wall Street Journal. Huawei faces ongoing US trade sanctions that began in 2019 and limit access to specialized manufacturing equipment.
Chinese scientists are developing advanced 2D semiconductor materials with 1,000-fold growth speed, promising applications in optoelectronics such as LEDs, photodetectors and lasers, to overcome Moore's Law limitations.
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Tesla's Terafab chip manufacturing project is set to launch tomorrow, according to a post by Sawyer Merritt. The initiative addresses anticipated supply constraints for advanced chips. Elon Musk has previously highlighted the need for domestic production.
Apple is exploring semiconductor suppliers beyond its primary partner, Taiwan Semiconductor Manufacturing Company (TSMC), due to global chip shortages. The company has held discussions with Samsung and Intel, including visits to a Samsung plant in Texas. No major orders have been placed yet.