Huawei announced it aims to produce advanced chips matching 1.4-nanometer standards by 2031. The claim came during a semiconductor symposium held in Shanghai.
The company stated that its next-generation chips will be feasible and affordable. He Tingbo, head of Huawei's chip department, made the remarks at the event, according to The Wall Street Journal. Huawei faces ongoing US trade sanctions that began in 2019 and limit access to specialized manufacturing equipment.
Researchers at Peking University unveiled a prototype electronic design automation tool on Tuesday. The software supports Huawei's LogicFolding architecture introduced the day before. It aims to help develop advanced semiconductors without Western tools.
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A team from Nanjing University’s School of Integrated Circuits and Huawei has developed the first molybdenum disulfide-based multi-bit parallel microprocessor.
OpenAI is fast-tracking production of an AI-focused smartphone, with mass production set to begin in the first half of 2027. Analyst Ming-Chi Kuo predicts the company could manufacture 30 million units over 2027 and 2028. The device aims to use AI agents in place of traditional apps.