Infineon is pushing TSMC to build a second chip factory in Dresden using the most advanced process nodes. Production chief Alexander Gorski made the remarks at the Bavarian Semiconductor Congress.
Alexander Gorski, Infineon’s head of production, said on July 7, 2026, in Munich that TSMC must build an additional factory with small structure sizes. The Taiwanese foundry’s first plant is already under construction in Dresden.
Besides Infineon, Bosch and NXP are also participating in the ten-billion-euro project. From 2027 the facility is scheduled to produce semiconductors in the 12- to 28-nanometer range mainly for the automotive industry.
Gorski noted that advanced AI chips are manufactured with 3- to 5-nanometer technology. Such components do not yet play a central role for European industry but could gain importance in the coming years.
