中国研发下一代2D芯片,生长速度提升千倍

中国科学家正研发先进2D半导体材料,生长速度提升1000倍,有望用于LED、光电探测器和激光器等光电子领域,突破摩尔定律限制。

摩尔定律预测半导体容量每两年翻一番,但随着芯片尺寸不断缩小,物理限制使性能进一步提升变得越来越困难。

在2D半导体中,通过添加微量其他元素(掺杂)可改变其导电能力,产生n型(负型)和p型(正型)材料。虽然存在许多n型2D半导体,如二硫化钼和二硒化钼,但高性能且稳定的p型材料稀缺。

国防科技大学朱孟健在《科技日报》周四报道中表示:“芯片中的晶体管需要n型和p型材料成对工作。高性能p型材料的缺乏已成为亚5纳米节点2D半导体发展的关键瓶颈,也是激烈争夺的科学与技术前沿。”

这种先进材料在光电子领域展现潜力,可用于LED、光电探测器和激光器,推动下一代‘2D芯片’发展。

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